The industrial design of the module incorporates several innovative features. It uses Agilent’s E-PAC concept for the packaging of electronics and mechanical assemblies. This concept is based upon the use of expanded polypropylene (EPP) layers of foam plastic spacers in which the mechanical and electronic boards components of the module are placed. This pack is then housed in a metal inner cabinet which is enclosed by a plastic external cabinet. The advantages of this packaging technology are:
virtual elimination of fixing screws, bolts or ties, reducing the number of components and increasing the speed of assembly/disassembly,
the plastic layers have air channels molded into them so that cooling air can be guided exactly to the required locations,
the plastic layers help cushion the electronic and mechanical parts from physical shock, and
the metal inner cabinet shields the internal electronics from electromagnetic interference and also helps to reduce or eliminate radio frequency emissions from the instrument itself.
base-id: 3002150155
id: 3002150155